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Assembly Production and Microelectronics
- Thin-film
technology.
- Thick-film
technology.
- Assembly of
microelectronic devices.
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Production of printed
circuit boards.
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Installation of printed
circuit boards.
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Electronic component
base (ECB) incoming inspection.
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Manufacture of
wire-wrap articles, harnesses and cables.
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Assembly production and
final testing.
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Electroplating.
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All items of work for mechanical
assembly of assembly units and subassemblies are carried out for the
instrument-making and machine-building industries. -
Products are assembled by means of
welding, soft and hard soldering, vacuum soldering with
high-temperature solders, ultrasonic aluminum brazing, titanium and
titanium alloy brazing, and eutectic aluminum alloy bonding. -
The following operations are performed in the assembly
production: -
1. Assembly and adjustment of
radioelectronic packages and instrumentation systems. -
2. Assembly of mechanical and electromechanical units. - Assembly of high-precision
electromechanical products is performed in the rooms of cleanliness
level 7 according to ISО14644-1.
The
production is equipped with the special-purpose equipment to the
full, which provides the use of automatic and mechanical machines in
a number of process operations:
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ECB preparation for installation;
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ECB automated soldering;
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automated washing of printed
circuit boards after the ECB installation;
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automatic test and monitoring of
electric parameters;
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automatic test of intrablock
installation;
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mechanical varnishing, dipping,
filling, sealing of products.
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